Most of the potting of electronic products now uses silicone potting compound, polyurethane potting compound and epoxy potting compound. Because these three glues can be selected for different products. Its adhesion is very good, and it is also very good in sealing and waterproofing. The following is a detailed explanation of the difference between these three potting adhesives.
Silicone encapsulant
The long-term and effective protection of sensitive circuits and electronic components is undoubtedly playing an increasingly important role in today's sophisticated and demanding electronic applications, and two-component silicone potting materials are undoubtedly one of the best choices. Silicone potting material has stable dielectric insulation, which is an effective guarantee to prevent environmental pollution, and can eliminate the stress caused by shock and vibration in a large temperature and humidity range.
Polyurethane potting glue
Polyurethane elastic potting material overcomes the disadvantages of brittle epoxy resin and low strength and poor adhesion of silicone resin, and has excellent water resistance, heat resistance, cold resistance, ultraviolet resistance, acid and alkali resistance, and high and low temperature impact resistance. , Moisture-proof, environmental protection, high cost performance, is an ideal potting protection material for electronic components.
epoxy resin encapsulant
Epoxy potting adhesive has good fluidity and can easily penetrate into the gap of the product; it can be cured at room temperature or medium temperature, and the curing speed is moderate; after curing, there are no bubbles, the surface is smooth, shiny, and high in hardness; the cured product has good acid and alkali resistance, It has good moisture-proof, waterproof, oil-proof and dust-proof performance, and is resistant to humidity and heat and atmospheric aging; it has good electrical and physical properties such as good insulation, compression resistance, and high bonding strength.
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