ZS-GF-5299Z Two-Part Addition Silicone Potting Compound

ZS-GF-5299Z Two-Part Addition Silicone Potting Compound

https://youtu.be/1jnXXeVzk_0
https://youtu.be/1jnXXeVzk_0
ZS-GF-5299Z Two-Part Addition Silicone Potting Compound
ZS-GF-5299Z Two-Part Addition Silicone Potting Compound

ZS-GF-5299Z Two-Part Addition Silicone Potting Compound

Packaging : 10kg/pail, 20kg/pail, 25kg/pail
Port : Guangzhou, Shenzhen, Yiwu, Shanghai, Hangzhou, Qingdao, Lianyungang, China
Place : Guangzhou, China
ZS-GF-5299Z is a medium viscosity two-part addition silicone potting component which has excellent thermal conductivity. This product will not release of low molecular. It is adapted to all kinds of material like PC, PP, ABS, PVC and metal's surface, which has good stability under -40 ℃～200 ℃. It's widely used for led driver and electronic components.
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Product manual
ZS-GF-5299Z is a medium viscosity two-part addition silicone potting component which has excellent thermal conductivity. This product will not release of low molecular. It is adapted to all kinds of material like PC, PP, ABS, PVC and metal's surface, which has good stability under -40 ℃～200 ℃. It's widely used for led driver and electronic components.
Product feature
  • Room temperature or heat accelerated cure
  • No substance is released during curing
  • Flexible and stable from -40 °C to 200 °C after cured 
  • Excellent electrical properties with high impedance and high dielectric strength
  • Excellent anti-sedimentation design, suitable for long-distance transportation and long-term storage
Main purpose
  • Suitable for general potting/encapsulant material of power supplies or other components thermal release
Standards compliant
UL
REACH
ROHS,
Technical parameters
Item Part A Part B Standard
Uncured Color Light Red  Grey Q/ZS 1-2016
Viscosity (cps, 25℃) 12000～18000 12000～18000 GB/T 10247
Mixing Ratio by Weight 1∶1 Q/ZS 1-2016
Viscosity after Mixing (cps, 25℃) 12000～18000 GB/T 10247
Working Time (min, 25℃) 60-90 Q/ZS 1-2016
Potting Time (hr, 25℃) 4-6 GB/T 531.2
Cured Hardness (shore A)  10-20 GB/T 531.2
Thermal Conductivity [W/(m·K)] ≧3 ASTM D5470
Dielectric Strength (KV/mm) ≧15 GB/T 1695
Dielectric Constant (1.0MHz) 2.8~3.3 GB/T 1694
Volume Resistivity (Ω·cm) ≧1.0×1013 GB/T 1692
Specific Gravity (g/cm3) 3.0±0.1 GB/T 13354
Use restrictions
Reasons for poor curing of addition silicone potting compound:
1.Contact materials: When in contact with the following ingredients, it will affect the surface curing. The slight one will only cure incompletely on the surface, and the heavy one will cause permanent or even incomplete curing:
   ● Release agent, such as detergent;
   ● Plasticizers, such as certain plasticizers in insulating plastics, wires and protective coils;
   ● Substances containing nitrogen, phosphorus, sulfur and halogen, such as natural rubber and neoprene;
   ● Soldering flux, such as rosin;
   ● Organometallic (lead, tin, mercury, etc.);
   ● Amine-containing substances, such as polyurethane and epoxy resin
   ● Condensation silicone sealant or potting compound
2.Environment: When using, avoid residual oil in the container or the object being used; avoid some impurities falling into it;avoid contact with some commonly used plasticizer plastic and
rubber glove; whether the vacuum equipment or oven has used (at the same time) epoxy resin, polyurethane, condensation silicone products.
3.Operational aspects: The mixing ratio is not carried out in accordance with the technical parameters; because some products have not been used for a long time, there is some sedimentation, and each component is not fully stirred before use.